DFI EC900-QCS

EC900-QCS – Ultra Compact Fanless Embedded System with Qualcomm® QCS6490 Platform

The EC900-QCS from DFI is an ultra-compact fanless embedded system designed for edge AI, industrial automation, autonomous mobile robots (AMR), IoT applications, and space-constrained industrial deployments. Based on the Qualcomm® QCS6490 platform with an integrated Qualcomm® Kryo™ 670 Octa-Core processor, it delivers efficient computing performance with low power consumption.

The processor features 8 cores running up to 2.7 GHz and provides up to 12 TOPS (INT8) AI performance. The EC900-QCS integrates LPDDR5x onboard memory with 4GB or 8GB capacity and includes 128GB UFS 3.1 storage as standard. A microSD card slot is available for additional storage expansion.

For expansion, the system provides 1× M.2 B-Key 3052 for communication modules such as LTE and 1× M.2 E-Key 2230 for WiFi/Bluetooth connectivity. A Nano SIM slot is also available. The rich I/O includes 1× Gigabit Ethernet, 1× HDMI 1.4, 2× USB 3.1 Gen1, RS-232, 8-bit DIO, and CAN FD support.

The rugged metal enclosure supports DIN-rail mounting, while the fanless design ensures reliable operation in industrial environments. With an ultra-small footprint of 145 × 34 × 96 mm and typical power consumption of approximately 3W, the EC900-QCS is ideal for compact edge computing solutions.