DFI EC633-RPS

EC633-RPS – Modular High-Performance Embedded PC with 14th/13th/12th Gen Intel® Core™ Processors

The EC633-RPS from DFI is a high-performance modular embedded PC designed for edge AI, industrial automation, machine vision, smart manufacturing, industrial networking, and 5G communication. Powered by 14th, 13th, and 12th Gen Intel® Core™ processors and the Intel® R680E chipset, it delivers outstanding computing performance, extensive expandability, and rich connectivity for demanding industrial environments.

The EC633-RPS supports Intel® Core™ processors up to 65W TDP in an LGA1700 socket and features two DDR5-4800 SO-DIMM slots supporting up to 64GB of memory. Storage and expansion capabilities include two M.2 2280 M-Key slots along with multiple interfaces for AI, storage, and communication modules.

The system provides 2× Intel® 2.5GbE, 4× Intel® Gigabit Ethernet, 9 COM ports, 5× USB 3.2 Gen2, 1× USB Type-C, and HDMI, DisplayPort++, and VGA for triple-display support. It also supports 5G communication modules, DFI Out-of-Band (OOB) management, TPM 2.0, and multiple PCIe, Mini PCIe, and M.2 expansion slots.

With its 9~36V DC wide-range power input, rugged metal enclosure, active cooling, and operating temperature of -20°C to 70°C, the EC633-RPS is an ideal platform for high-performance industrial edge computing and AI applications.