3.5" SBC with Intel® Tiger Lake-UP3 for Fanless, Ultra Low-Power, High-Performance & Wide Temperature Solution

Key Features: 

• Intel® 11th Gen Tiger Lake-UP3 Embedded/Industrial SKU Series
• DDR4 3200 MHz SODIMM Slot up to 64GB
• Quadruple independent displays: DP++ , HDMI, 2 LVDS/eDP
• 2 2.5GbE LAN with RJ-45
• 1 M.2 B key (with NANO SIM-holder), 1 M.2 E key
• 1 M.2 M key, 1 SATA 3.0 for storage
• SATA RAID 0/1 (Supported by i7/i5 SKUs)
• 4 USB 3.2 Gen 2, 4 USB 2.0, 4 COM (4 RS-485), DIO, Audio
• Onboard TPM 2.0
• Wide Voltage DC-IN 12~24V (OCP & OVP)
• Wide operating temperature supported